Supercritical CO₂ cleaning system No liquid waste. No drying process required.
Cleaning technology using the dissolving power of supercritical CO₂ is attracting attention in a wide range of fields as an environmentally friendly technology. Supercritical CO₂ has low surface tension, allowing it to penetrate into tight spaces and to clean semiconductor parts and precision components without destroying their microstructure.
Characteristics
- No drying process required
- Easy to recycle and reuse cleaning liquid
- No need to dispose of cleaning waste
Specifications
Design pressure | 10MPa |
Design temperature | 40℃ |
Cleaning vessel volume | 12L |
System configuration
- Cleaning vessel (with external heater and auto-open/close lid)
- Liquid CO₂ supply tank (with built-in condenser)
- Waste liquid recovery tank (with built-in heater)
- Chiller (5.5kw)
- Filter (switchable)
- Controller (touch panel)
Features
- Operating range is from subcritical to supercritical
- Separates carbon dioxide gas and residue contained in cleaning effluent
- Carbon dioxide gas is liquefied and reused
- Residue is highly concentrated because it does not contain washing solution
Object to be cleaned
- Textiles: Garment cleaning, removal of residual toxic substances
- Precision parts : Oil removal, solvent removal
- Semiconductor : Wafer, resist film removal, IT parts cleaning
Advantage
- Capable of cleaning water- and heat-sensitive parts
- No drying time required
- Composite assemblies can be cleaned
Options
- CO₂ recovery system
- Display monitor
*Various types of support are available upon consultation.